- Collaboratively define, create and review embedded imaging related architectures and embedded HW designs with respect to:
o System architecture and design aspect
o Power flow and power integrity
o General Signal flow and connector placement for DFM
o RF link budgets
o EMI/EMC considerations
o DFM and Thermal considerations
o Critical component selection
- Closely interface with the other development teams for:
o Ensuring and validating component specifications
o Defining hardware testing and developing testing requirements and protocols
o Performing product Mech-Elec integration and product testing
o Reviewing designs for DFM and power integrity
o Participating in design reviews
o Optimizing BOM during product design
o Transitioning and supporting designs for EMI testing and other electrical testing such as PTCRB
- Define internal product specification and preliminary BOM as it relates to:
o Working with the Product and Engineering teams to define and maintain product HW specification
o Selecting components for design suitability and cost
o Putting together approximate BOM list tied to the design
o Costing preliminary BOMs
- Independently create or participate in creating design and development documentation:
o Product requirement documents
o Testing reports
o GPIO tables, bus resource allocation tables
o Power budget analysis documents
o HW planning and review documents
o Other relevant documentation as may be required by the project
- Coordinate and interface with our OPs team for:
o Component sourcing during development
o Transitioning designs to MP
o Assisting with factory MP testing preparation
o Leading design issue resolution as it relates to MP
o Identifying substitutes and long L/T parts to assist in MP readiness
