newmarket, on engineer (r&d) – electronics packaging Jobs – 4 Openings This Week

Electro-Mechanical Engineer
Geotech Ltd. —Aurora, ON
- $70,000–$80,000 a year
- Full-time
- CAD
- Engineering
- Bachelor's
Quick apply
Mechanical Engineer (R&D) – Electronics Packaging
Lotek Wireless —Newmarket, ON
- $80,000–$100,000 a year
- Full-time
- CAD
- Engineering
- Master's degree
Mechanical Engineer (R&D) - Electronics Packaging
Lotek —Newmarket, ON
- $80,000–$120,000 a year
- Full-time
- CAD
- Engineering
- Master's degree
- Disability insurance
- Dental care
Quick apply

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Mechanical Engineer (R&D) – Electronics Packaging
Lotek Wireless —Newmarket, ON
Bachelor’s or Master’s degree in Mechanical Engineering or related field. 10+ years in mechanical design for electronics packaging, preferably in ruggedized or…
$80,000–$100,000 a year

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Electro-Mechanical Engineer
Geotech Ltd. —Aurora, ON
*Testing & Failure Analysis:* Create and execute mechanical test plans (vibration, acoustic, and impact). *Reporting:* Ability to generate high-level technical…
$70,000–$80,000 a year
Quick apply
Mechanical Engineer (R&D) – Electronics Packaging
Lotek Wireless —Newmarket, ON
Bachelor’s or Master’s degree in Mechanical Engineering or related field. 10+ years in mechanical design for electronics packaging, preferably in ruggedized or…
$80,000–$100,000 a year

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Electro-Mechanical Engineer

Geotech Ltd. -
Aurora, ON

Quick apply

Job details

Full-time
$70,000–$80,000 a year

Qualifications

CAD
Engineering
Mechanical Engineering
Bachelor's
SolidWorks
Sensors
CATIA

Full job description

Electro-Mechanical Engineer

Location: Geotech Ltd.

Role Type: Full-Time / Aerospace & Geophysical Survey Systems

Salary: $70,000-$80,000 Salary per Year

Professional Profile

A multidisciplinary Engineer specializing in the design, simulation, and physical realization of airborne survey systems. Expert in bridging the gap between high-level CAD/CAE analysis and hands-on production. Proven ability to integrate sensitive electronics into rugged, flight-ready structures while maintaining a "boots-on-the-ground" approach to prototyping and manufacturing support.

Core Responsibilities

Advanced Structural Development: Lead the design and development of next-generation airborne systems and retrofits, ensuring a competitive edge through weight optimization and structural integrity.
Multidisciplinary Integration: Collaborate with electronics teams to design ruggedized enclosures, managing thermal dissipation, EMI/EMC shielding, and precision sensor mounting (magnetometers, Gyro, GPS, etc.).
Simulation & Validation: Perform rigorous numerical and analytical evaluations of stiffness, strength, and durability. Analyze impact of QS, Dynamic, and Thermal loading on mechanical and electronic hardware.
Rapid Prototyping: Drive the end-to-end prototyping cycle, utilizing 3D printing, CNC machining, and composite layups to validate designs before full-scale production.
Hands-on Production & Manufacturing: Actively participate in the assembly of first-article units. Work directly on the shop floor with in-house millwrights and technicians to troubleshoot assembly issues and refine manufacturing workflows.
Vendor & Contractor Management: Evaluate and oversee third-party contractors for prototype builds, ensuring all production units meet strict aerospace tolerances and quality standards.
Testing & Failure Analysis: Create and execute mechanical test plans (vibration, acoustic, and impact). Investigate field failures and implement design modifications to improve system reliability.

Technical Skills & Qualifications

Engineering & Analysis

CAD/CAE Mastery: Expert-level proficiency in CAD software (CATIA, SolidWorks or similar).
Structural Dynamics: 5–10 years of experience in modal analysis, SINE/Random vibration, and acoustic excitation (Aerospace standard).
Materials Expertise: In-depth knowledge of composite materials (fiberglass, carbon fiber, kevlar) and aerospace-grade alloys.

Electronics & Integration

Electronic Packaging: Design of PCB enclosures, cable harness routing, and environmental sealing (IP67/68).
Hardware Knowledge: Familiarity with sensors, actuators, and MIL-SPEC connectors.
Thermal Management: Analysis of heat transfer in enclosed electronic systems at varying altitudes.

Prototyping & "Hands-On" Skills

Shop Floor Capability: Proficient in using manual tools, assembly jigs, and diagnostic equipment.
DFM/DFA: Design for Manufacturability and Assembly to ensure seamless transition from digital model to physical product.
Reporting: Ability to generate high-level technical analysis reports and comprehensive test plans.

Education

Bachelor’s Degree in Mechanical Engineering, Aerospace Engineering, or a related field.

Geotech is committed to employment equity, diversity, and inclusion in the workplace. In accordance with provincial regulations, upon request, support will be provided for any accommodation requirements throughout the recruitment process.

Job Type: Full-time

Pay: $70,000.00-$80,000.00 per year

Work Location: In person

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Electro-Mechanical Engineer

Mechanical Engineer (R&D) – Electronics Packaging

Mechanical Engineer (R&D) - Electronics Packaging

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