Aurora, On Senior electrical engineer (analog & embedded systems) Jobs – 1 Openings This Week

Senior Embedded Hardware Design Engineer
iENSO —Richmond Hill, ON
- $95,000–$135,000 a year
- Full-time
- Engineering
- Windows
- Microsoft Office
Quick apply

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Senior Embedded Hardware Design Engineer
iENSO —Richmond Hill, ON
Minimum of 10 years of related experience in an engineering design and development environment. Bachelor's and/or Master’s degree in Electrical Engineering or…
$95,000–$135,000 a year
Quick apply
Senior Electrical Engineer – Product Development
Yorkville Sound —Pickering, ON
Produce clear design documentation, including specifications, test plans, and engineering reports. Typically 5+ years of experience in electronic hardware…

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Senior Embedded Hardware Design Engineer

iENSO -
Richmond Hill, ON

Quick apply

Job details

Full-time
$95,000–$135,000 a year

Qualifications

Jira
FPGA
Engineering
System architecture
Windows
Microsoft Office
Master's degree
C++
C
Bachelor's
Confluence
Electrical Engineering
Communication skills
Debugging
Time management

Full job description

Position title: Senior Embedded Hardware Design Engineer

Reporting to: Director of Systems Engineering

Department: Hardware and Systems Group

Employment status: Permanent, Full-Time

Position summary:

Reporting to the Director of Systems Engineering, the Senior Embedded Hardware Design Engineer designs and develops hardware for embedded systems such as digital high-performance cameras, embedded systems that include wireless modules such as WiFi or Bluetooth & Cellular modem subsystems, high-speed data bus systems, and general imaging and vision related subsystems. Working closely with mechanical and software engineers the position is responsible for selecting new components, designing digital imaging systems and subsystems, conducting various tests on prototypes, supporting and overseeing electrical certifications, and supporting the OPs team to transition designs to manufacturing.

Essential duties and high-level responsibilities:

Digital camera high speed board design

Image sensor board design

Embedded imaging system power supply design

Supporting of EMI/EMC and other electrical certifications

Design with wireless modules, cellular modems, LCD modules, CODECs and various sensor chips

Transition of designs to Mass Production and DFM

Employment Requirements:

Education level

Bachelor's and/or Master’s degree in Electrical Engineering or related field

Experience level

Minimum of 10 years of related experience in an engineering design and development environment

Abilities and skills

Design and Development Knowledge

Embedded system architecture and design

MCU and high-speed design

Design with camera specific DSP / SoC chips

Embedded & Analog Circuit Design for Imaging and Camera related products

Knowledge of PSPICE or equivalent for modeling of circuits

PCB design and Layout using ALTIUM and/or PADs

Layout rules and standards IPC 2221. IPC-A-610

Designing with dense BGA chips, DDR types of memory, and different data-bus types

Knowledge of UART, I2C, SPI, GPIO, PLL, ADC, MIPI, SDIO, ETH JTAG, serial FLASH

Power chain, power up, power down, charging and power budget creation

Understanding of embedded OS booting sequence and design implications

Understanding low-noise analog design and EMI compliance considerations

Ability to write basic test code in C or C++ for bringing up and prototyping newly designed boards, a plus

FPGA circuit design and related SW (VHDL), a plus

Tools and Testing

Hands on with prototyping circuits and ability to repair and rework for debugging and bringing up prototype PCBAs

Hands-on experience with oscilloscopes, spectrum analyzers, VNAs, DVMs, logic analyzers, and other design and development supporting instruments and tools

MS Windows / MS Office

PM software

Confluence

Jira

Version control Software

Team and Aptitude

Strong team-player skills

Good communication skills

Dedicated and honest

Strong time-management skills

Able to work independently as needed, and work closely with others as team player for joint tasks

Ability to think fundamentally

Strong problem-solving skills, fast learning, and multi-tasking

Taking initiative and ownership

Other requirements

Previous experience with imaging and computer vision would be an asset

Canadian Citizenship or Permanent resident status

Ability to travel outside Canada

Position Scope and Responsibilities

Collaboratively define, create and review embedded imaging related architectures and embedded HW designs with respect to:

o System architecture and design aspect

o Power flow and power integrity

o General Signal flow and connector placement for DFM

o RF link budgets

o EMI/EMC considerations

o DFM and Thermal considerations

o Critical component selection

Closely interface with the other development teams for:

o Ensuring and validating component specifications

o Defining hardware testing and developing testing requirements and protocols

o Performing product Mech-Elec integration and product testing

o Reviewing designs for DFM and power integrity

o Participating in design reviews

o Optimizing BOM during product design

o Transitioning and supporting designs for EMI testing and other electrical testing such as PTCRB

Define internal product specification and preliminary BOM as it relates to:

o Working with the Product and Engineering teams to define and maintain product HW specification

o Selecting components for design suitability and cost

o Putting together approximate BOM list tied to the design

o Costing preliminary BOMs

Independently create or participate in creating design and development documentation:

o Product requirement documents

o Testing reports

o GPIO tables, bus resource allocation tables

o Power budget analysis documents

o HW planning and review documents

o Other relevant documentation as may be required by the project

Coordinate and interface with our OPs team for:

o Component sourcing during development

o Transitioning designs to MP

o Assisting with factory MP testing preparation

o Leading design issue resolution as it relates to MP

o Identifying substitutes and long L/T parts to assist in MP readiness

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